Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method-Reference-Cited by-同舟云学术

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Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method

Published:2023-11-10 Issue: Volume: Page:1659-1664
ISSN:
Container-title:2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
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Author:

Hui Xiaoshuang¹,Ning Puqi¹,Fan Tao¹,Wang Kai¹,Mei Yunhui²,Lei Guangyin³

Affiliation:

1. Institute of Electrical Engineering Chinese Academy of Sciences, University of Chinese Academy of Sciences,Beijing,China

2. School of Electrical Engineering, Tiangong University,Tianjin,China

3. Academy for Engineering and Technology, Fudan University,Shanghai,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10394673/10394683/10395634.pdf?arnumber=10395634

Reference7 articles.

1. The Study on Thermal Coupling Effect for SiC Power Module Design Guidelines

2. A finite differential method based compact thermal model in PSPICE

3. LaBCof: Lattice Boltzmann boundary condition framework

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