Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years-Reference-Cited by-同舟云学术

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Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years

Published:2023-12-05 Issue: Volume: Page:1022-1025
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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Author:

Refai-Ahmed G.¹,Gektin V.²,Alissa H.³,Subbarayan G.⁴,Huttunen J.⁵,Chan G B.⁶

Affiliation:

1. AMD

2. Qualcomm

3. Microsoft

4. Purdue University

5. Nokia

6. Binghamton University

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457914.pdf?arnumber=10457914

Reference3 articles.

1. Invited Talk: Pathfinding to Maximization of AI/HPC/GPC System Performance

2. EPTC 2021 Invited Technology Talk: Roadmap Based on Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Qualification of High Coplanarity Package for General Purpose Processor;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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