Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip-Reference-Cited by-同舟云学术

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Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Published:2001 Issue:10 Volume:19 Page:1543-1559
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Ayliffe M.H.,Rolston D.R.,Chuah A.E.L.,Bernier E.,Michael F.S.J.,Kabal D.,Kirk A.G.,Plant D.V.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/50/20677/00956142.pdf?arnumber=956142

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and analysis of an adaptive board-to-board dynamic holographic interconnect;Applied Optics;2004-06-01

2. Effects of misalignments in packaging of array-based optical interconnects and processors;Optical Information Systems;2003-11-03

3. Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications;Applied Optics;2003-05-10

4. Design rules for highly parallel free-space optical interconnects;IEEE Journal of Selected Topics in Quantum Electronics;2003-03

5. Simple integration technique to realize parallel optical interconnects: implementation of a pluggable two-dimensional optical data link;Applied Optics;2002-09-10

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