Cool silicon ICT energy efficiency enhancements
Author:
Ellinger F.1, Mikolajik T.2, Fettweis G.1, Hentschel D.3, Kolodinski S.4, Warnecke H.5, Reppe T.6, Tzschoppe C.1, Dohl J.1, Carta C.1, Fritsche D.1, Wiatr M.4, Kronholz S.D.4, Mikalo R.P.4, Heinrich H.5, Paulo R.1, Wolf R.1, Hubner J.7, Waltsgott J.1, Meissner K.1, Richter R.1, Bausinger M.8, Mehlich H.9, Hahmann M.1, Moller H.10, Wiemer M.3, Holland H.-J.3, Gartner R.11, Schubert S.12, Richter A.1, Strobel A.1, Fehske A.1, Cech S.1, Assmann U.1, Hoppner S.1, Walter D.1, Eisenreich H.1, Schuffny R.1
Affiliation:
1. TU Dresden, Germany 2. Namlab, Germany 3. Fraunhofer, Germany 4. Globalfoundries, Germany 5. Infineon, Germany 6. SiSax, Germany 7. Radioopt, Germany 8. Plastic Logic, Germany 9. Roth&Rau, Germany 10. nxp, Germany 11. xfab, Germany 12. PE, Germany
Cited by
1 articles.
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