Microstructural Study of Lead Free Solder Joints Subjected to Mechanical Cyclic Loading Under Various Conditions-Reference-Cited by-同舟云学术

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Microstructural Study of Lead Free Solder Joints Subjected to Mechanical Cyclic Loading Under Various Conditions

Published:2021-06-01 Issue: Volume: Page:
ISSN:
Container-title:2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Hoque Mohd Aminul,Ashraful Haq Mohammad,Suhling Jeffrey C.,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9502930/9503122/09503211.pdf?arnumber=9503211

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Behavior and Microstructure Evolution in SAC+Bi Lead Free Solders Subjected to Mechanical Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

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