Author:
Bergendahl Marc,Jain Aakrati,Parekh Dishit,Saraf Iqbal,Bonam Ravi,Sikka Kamal,Goldfarb Dario,Zhang Hongqing,Cropp Ed,Miyazawa Risa,Matsumoto Keiji,Hisada Takashi,Mori Hiroyuki
Cited by
3 articles.
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1. Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31