Author:
El Amine Belhadi Mohamed,Akkara Francy John,Hoque Mohd Aminul,Vyas Palash Pranav,Wei Xin,Shmatok Andrii,Hamasha Sa'd,Prorok Barton Charles,Suhling Jeff,Lall Pradeep
Cited by
11 articles.
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1. Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature;Microelectronics Reliability;2023-10
2. Predicting the Life of the Solder Joints in Electronic Assemblies using Physics-informed Data-driven Methodology;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Evolution of the Creep Response of SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposures;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Drop Shock Performance of SAC-Bi Compared to SnPb;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31