A Fully Integrated Bit-to-Bit 24/48Gb/s QPSK/16-QAM D-Band Transceiver with Mixed-Signal Baseband in 28nm CMOS Technology-Reference-Cited by-同舟云学术

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A Fully Integrated Bit-to-Bit 24/48Gb/s QPSK/16-QAM D-Band Transceiver with Mixed-Signal Baseband in 28nm CMOS Technology

Published:2023-11-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)
language:
Short-container-title:

Author:

Guan Pingda¹,Jia Haikun¹,Deng Wei¹,Ma Ruichang¹,Deng Mingxing¹,Xue Jiamin¹,Yan Angxiao¹,Sun Shiyan¹,Wang Zhihua¹,Chi Baoyong¹

Affiliation:

1. School of Integrated Circuits, Tsinghua University,BNRist

Funder

National Key R&D Program of China

Beijing Innovation Center for Future Chip

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10347557/10347908/10347912.pdf?arnumber=10347912

Reference6 articles.

1. 17.8 A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m

2. A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link

3. A D-Band Radio-on-Glass Module for Spectrally-Efficient and Low-Cost Wireless Backhaul

4. A 50 Gbps 134 GHz 16 QAM 3 m Dielectric Waveguide Transceiver System Implemented in 22nm CMOS

5. A Fully Integrated 160Gb/s D-Band Transmitter with 1.1pJ/b Efficiency in 22nm FinFET Technology;Callender;ISSCC,2022

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