Electrical Trees of Silicone Gel Encapsulation Materials in Power Electronic Modules Self-Healing Properties and Influencing Factors
Author:
Affiliation:
1. North China Electric Power University, Beijing, China
2. School of Electrical Engineering Shandong University, Jinan, China
Funder
National Key R&D Program of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering
Link
http://xplorestaging.ieee.org/ielx7/28/10410107/10177236.pdf?arnumber=10177236
Reference17 articles.
1. Silicone Materials for Electrical Insulation: A Dielectric Study of Oil Versus Gel
2. Power Electronics Reliability: State of the Art and Outlook
3. High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
4. Review of packaging insulation reliability for high voltage power module;Li,2022
5. A review of research on SiC IGBT power electronic device packaging and insulation;Dai;Zhejiang Electric Power,2019
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