Multiscale Electrothermal Design of a Modular Multilevel Converter for Medium-Voltage Grid-Tied Applications-Reference-Cited by-同舟云学术

Multiscale Electrothermal Design of a Modular Multilevel Converter for Medium-Voltage Grid-Tied Applications

Published:2023-05 Issue:3 Volume:59 Page:3773-3784
ISSN:0093-9994
Container-title:IEEE Transactions on Industry Applications
language:
Short-container-title:IEEE Trans. on Ind. Applicat.

Author:

Feng Xuhui¹^ORCID,Kotecha Ramchandra²,Narumanchi Sreekant¹^ORCID,Singh Akanksha³^ORCID,Mather Barry¹^ORCID,Wang Ke⁴,Hu Boxue⁵^ORCID,Wang Jin⁶^ORCID

Affiliation:

1. National Renewable Energy Laboratory, Golden, CO, USA

2. GE Research, Niskayuna, NY, USA

3. DNV, Highlands Ranch, CO, USA

4. The Ohio State University, Columbus, OH, USA

5. Delta Electronics (Americas) Ltd., Fremont, CA, USA

6. Department of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USA

Funder

U.S. Department of Energy Office of Energy Efficiency and Renewable Energy Advanced Manufacturing Office

National Renewable Energy Laboratory

Alliance for Sustainable Energy, LLC

U.S. Department of Energy

U.S. DOE EERE AMO

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering

Link

https://ieeexplore.ieee.org/ielam/28/10129242/10068774-aam.pdf

Reference25 articles.

1. Analysis of thermal cycling stress on semiconductor devices of the Modular Multilevel Converter for drive applications

2. Thermal Modelling of IGBT Devices

3. Thermal study of a modular multilevel converter submodule;polanco;Proc PCIM Europe Digit Days Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage,2020

4. Submodule Temperature Regulation and Balancing in Modular Multilevel Converters

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