Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks-Reference-Cited by-同舟云学术

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Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks

Published:2009-02 Issue:1 Volume:51 Page:67-77
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Sharma Rohit,Chakravarty Tapas,Bhattacharyya Amalendu Bhushan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/15/4785349/04785161.pdf?arnumber=4785161

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