Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips
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Published:2015-05
Issue:5
Volume:23
Page:869-878
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ISSN:1063-8210
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Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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language:
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Short-container-title:IEEE Trans. VLSI Syst.
Author:
Qiu Xiang,Marek-Sadowska Malgorzata,Maly Wojciech P.
Funder
National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software