Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning-Reference-Cited by-同舟云学术

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning

Published:2022-09 Issue:9 Volume:30 Page:1230-1243
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Nigussie Theodros¹^ORCID,Schabel Josh C.²^ORCID,Lipa Steve³,McIlrath Lisa⁴^ORCID,Patti Robert⁵^ORCID,Franzon Paul³^ORCID

Affiliation:

1. DEVCOM Army Research Laboratory, Adelphi, USA

2. Intel, Santa Clara, USA

3. Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC, USA

4. DARPA, Arlington County, USA

5. NHanced Semiconductors, Inc, Batavia, USA

Funder

DARPA-Office of Naval Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

Reference37 articles.

2. Design flow reveals benefits of hybrid bonding for 3D integration;nigussie;IEEE Trans Compon Packag Manuf Technol,0

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