Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Author:
Affiliation:
1. Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany
2. Technische Universität Dresden, 01069, Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7481053/7486763/07486872.pdf?arnumber=7486872
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization;Micromachines;2022-08-01
2. Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist;Micromachines;2021-07-21
3. A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-11
4. Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions;Journal of Electronic Packaging;2020-08-27
5. Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05
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