Reliability test for integrated Glass interposer-Reference-Cited by-同舟云学术

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Reliability test for integrated Glass interposer

Published:2016-04 Issue: Volume: Page:
ISSN:
Container-title:2016 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Ching-Kuan Lee ,Jen-Chun Wang ,Yu-Min Lin ,Chau-Jie Zhan ,Wen-Wei Shen ,Huan-Chun Fu ,Yuan-Chang Lee ,Chia-Wen Chiang ,Su-Ching Chung ,Su-Mei Chen ,Chia-Wen Fan ,Hsiang-Hung Chang ,Wei-Chung Lo ,Yung Jean Lu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7481053/7486763/07486780.pdf?arnumber=7486780

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The interfacial reliability of through-glass vias for 2.5D integrated circuits;Microelectronics International;2020-08-04

2. Fruits: A Source of Polyphenols and Health Benefits;Natural and Artificial Flavoring Agents and Food Dyes;2018

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