Realization of High Power MMIC Amplifier in QFN Package at Ka-Band-Reference-Cited by-同舟云学术

Realization of High Power MMIC Amplifier in QFN Package at Ka-Band

Published:2022-11-20 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE North Karnataka Subsection Flagship International Conference (NKCon)
language:
Short-container-title:

Author:

Behera Rashmi¹,Bollu Srinivasa Rao¹,J Nagesha¹,Lonkadi Suma S¹,Andhiwal Ajay¹,Singh Kamaljeet¹

Affiliation:

1. U.R. Rao Satellite Centre,Bangalore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10126138/10126139/10126644.pdf?arnumber=10126644

Reference16 articles.

1. Effects of Solder Voiding on the Reliability and Thermal Characteristics of Quad Flatpack No-lead (QFN) Components

2. QFN reliability, thermal shock, lead-free vs. SnPb, microstructure

3. Design and Development of High Performance Ceramic Packaging for Low Noise and High Gain GaAs MMIC

4. Ka-band low loss and cost MMIC-integration in standard QFN-package;safdary;DCE21 13 Symposium on Electrical and Computer Engineering Book of Abstracts,0

5. Electromagnetic Simulation and Realization of MCM GaAs MMICs Based Packaging for High Gain (40 dB) and High-Power (33dBm) Transmitter Applications

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Role of Plastic Encapsulant on the RF Performance of the GaN Based HEMT Amplifier;2023 4th International Conference on Communication, Computing and Industry 6.0 (C216);2023-12-15

2. Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Cross-Over Wire-Bonding for Millimeter-Wave Applications;IEEE Electron Device Letters;2023-12

4. Improved electrical properties in three phase poly (vinylidene fluoride) nanocomposites with hybrid fillers of titanium dioxide and MXene;Materials Today Communications;2023-03