登录 注册 会员服务 联系我们

Observation of Plasma-Induced Damage in Bulk Germanium ${p}$ -Type FinFET Devices and Curing in High-Pressure Anneal

  • Published:2019-06 Issue:2 Volume:19 Page:468-470
  • ISSN:1530-4388
  • Container-title:IEEE Transactions on Device and Materials Reliability
  • language:
  • Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Hiblot GaspardORCID,Arimura Hiroaki,Witters Liesbeth,Chiu Eddie,Liu Yefan,Mitard Jerome,Horiguchi Naoto,Collaert Nadine,Van der Plas GeertORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation;IEEE Transactions on Device and Materials Reliability;2023-09

2. A Harmonic Radar Tag With High Detection Range Utilizing Ge FinFETs CMOS Technology;IEEE Electron Device Letters;2022-11

3. Anomaly of NBTI data for PMOS transistors degraded by plasma processing induced charging damage (PID);2022 IEEE International Integrated Reliability Workshop (IIRW);2022-10-09

4. Antenna effect in 65nm NMOS devices with 9.5nm thick HfOx gate dielectric;2021 IEEE International Integrated Reliability Workshop (IIRW);2021-10-04

5. Process-induced charging damage in IGZO nTFTs;2021 IEEE International Reliability Physics Symposium (IRPS);2021-03
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3