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Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part II: Model

  • Published:2016-09 Issue:3 Volume:16 Page:326-335
  • ISSN:1530-4388
  • Container-title:IEEE Transactions on Device and Materials Reliability
  • language:
  • Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Talebanpour B.ORCID,Sahaym U.,Dutta I.

Funder

Strategic Environmental Research and Development Program (SERDP)

Semiconductor Research Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On the anisotropic indentation modulus and anisotropic creep behavior of β-Sn characterized by nanoindentation methods;Materials Science and Engineering: A;2022-07

2. Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

3. Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test;Microelectronics Reliability;2020-09

4. Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors;IEEE Transactions on Power Electronics;2020-09

5. Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-08
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