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Development of Multi-Layer Fabrication Process for SFQ Large Scale Integrated Digital Circuits

  • Published:2021-08 Issue:5 Volume:31 Page:1-4
  • ISSN:1051-8223
  • Container-title:IEEE Transactions on Applied Superconductivity
  • language:
  • Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Ying LiliangORCID,Zhang XueORCID,Niu Minghui,Ren JieORCID,Peng WeiORCID,Maezawa Masaaki,Wang Zhen

Funder

Strategic Priority Research Program of Chinese Academy of Sciences

Science and Technology Commission of Shanghai Municipality

Chinese Academy of Sciences

Chinese Academy of Sciences Key Technology Talent Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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1. Molybdenum low-resistance thin-film resistors for cryogenic devices;Superconductor Science and Technology;2024-09-02

2. An energy-efficient 32-bit bit-parallel superconducting SFQ specialized processor;Superconductivity;2024-06

3. CMOS-to-SFQ Interface Circuits for RZ and NRZ Coded Signals Transformation;IEEE Transactions on Applied Superconductivity;2024-06

4. Test Performance Analysis of Rapid Single Flux Quantum Circuits With Auxiliary Circuits;IEEE Transactions on Applied Superconductivity;2024-06

5. Timing Evaluation of Passive Transmission Line by RSFQ Ring Oscillator;IEEE Transactions on Applied Superconductivity;2024-05
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