Design of Scalable Superconducting Quantum Circuits Using Flip-Chip Assembly-Reference-Cited by-同舟云学术

Design of Scalable Superconducting Quantum Circuits Using Flip-Chip Assembly

Author:

Park Seong Hyeon¹^ORCID,Baek Dowon²^ORCID,Park Insung³^ORCID,Hahn Seungyong¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Seoul National University, Seoul, South Korea

2. Department of Physics and Astronomy, Seoul National University, Seoul, South Korea

3. Korea Electrotechnology Research Institute, Gyeongsangnam-do, South Korea

Funder

Samsung

National R&D Program

National Research Foundation of Korea

Ministry of Science and ICT, South Korea

Applied Superconductivity Center

Electric Power Research Institute of Seoul National University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference44 articles.

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