Artificial Intelligence-Aided Thermal Model Considering Cross-Coupling Effects-Reference-Cited by-同舟云学术

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Artificial Intelligence-Aided Thermal Model Considering Cross-Coupling Effects

Published:2020-10 Issue:10 Volume:35 Page:9998-10002
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Zhang Yi^ORCID,Wang Zhongxu^ORCID,Wang Huai^ORCID,Blaabjerg Frede^ORCID

Funder

Innovationsfonden

Advanced Power Electronic Technology and Tools

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9127988/09034112.pdf?arnumber=9034112

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PINN-based Dynamical Modeling and State Estimation in Power Inverters;2024 IEEE Conference on Control Technology and Applications (CCTA);2024-08-21

2. Thermal Impedance Matrix Characterization of IGBT Modules with Different Configurations;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

3. A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects;IEEE Transactions on Power Electronics;2024-05

4. Active Thermal Control and Power Loss Reduction Scheme for Three-Level Active Neutral-Point-Clamped Inverters With Hybrid Modulation;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-04

5. Design of Thermal System Integrating Chaotic Optimization Strategy and Resilient Back Propagation;IEEE Access;2024

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