A Review of Select Patented Technologies for Cooling of High Heat Flux Power Semiconductor Devices-Reference-Cited by-同舟云学术

A Review of Select Patented Technologies for Cooling of High Heat Flux Power Semiconductor Devices

Published:2023-06 Issue:6 Volume:38 Page:6790-6794
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Joshi Shailesh N.¹^ORCID,Zhou Feng¹,Liu Yanghe¹^ORCID,Lohan Danny J.¹,Ukegawa Hiroshi¹,Lee Jae¹,Dede Ercan M.¹^ORCID

Affiliation:

1. Toyota Research Institute of North America, Toyota Motor North America, Inc., Ann Arbor, MI, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/10103359/10041820.pdf?arnumber=10041820

Reference70 articles.

1. Novel Electro-Thermal Coupling Simulation Technique for Dynamic Analysis of HV (Hybrid Vehicle) Inverter

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3. Ultra compact and high reliable SiC MOSFET power module with 200 $^{\circ }$C operating capability;horio;Proc IEEE 24th Int Symp Power Semicond Devices ICs,0

4. Design of 400 V class inverter drive using SiC 6-in-1 power module;shirabe;Proc IEEE Energy Convers Congr Expo,0

5. A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

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