A quad-core 28–32 GHz transmit/receive 5G phased-array IC with flip-chip packaging in SiGe BiCMOS
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8048779/8058449/08059027.pdf?arnumber=8059027
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. RFSoC-FPGA Realization of a Code-Multiplexed Digital Receiver (CMDR) Using 1-ADC/Quad-Channel;IEEE Journal of Microwaves;2024-01
2. A Cost-Effective Ku-Band Phased Array in Package Integrating Multi-Independent CMOS Transceivers With On-Chip Antennas;IEEE Microwave and Wireless Technology Letters;2023-10
3. Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. FORMAT: A Reconfigurable Tile-Based Antenna Array System for 5G and 6G Millimeter-Wave Testbeds;IEEE Systems Journal;2022-09
5. Comparative Analysis of Millimeter-Wave Transceivers for 5G Applications;2022 Moscow Workshop on Electronic and Networking Technologies (MWENT);2022-06-09
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