Transient Eddy-Current Driver Pickup Probe Response Due to a Conductive Plate
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/20/34778/08903495.pdf?arnumber=8903495
Cited by 33 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Absolute Wall Thickness Measurement of Conducting Plates Using Pulsed Eddy Currents;Journal of Electromagnetic Analysis and Applications;2024
2. Time-domain analytical solutions to pulsed eddy current model of moving cylindrical conductor;NDT & E International;2023-07
3. Through Thickness Inspection of Layered Magnetic Material Using Pulsed Eddy-Current Testing;IEEE Transactions on Instrumentation and Measurement;2023
4. A Fast and Robust Semi-Analytical Approach for the Calculation of Coil Transient Eddy-Current Response Above Planar Specimens;IEEE Transactions on Magnetics;2022-09
5. Wall Thinning Assessment for Ferromagnetic Plate with Pulsed Eddy Current Testing Using Analytical Solution Decoupling Method;Applied Sciences;2021-05-11
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