Effects of R-ratio and wave form on the fatigue of 63Sn-37Pb solder used in electronic packaging-Reference-Cited by-同舟云学术

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Effects of R-ratio and wave form on the fatigue of 63Sn-37Pb solder used in electronic packaging

Published:1988 Issue: Volume: Page:
ISSN:
Container-title:Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle
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Author:

Bae K.,Guo Z.,Sprecher A.F.,Conrad H.,Jung D.Y.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/767/578/00016166.pdf?arnumber=16166

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structure parameters and structure sensitive properties of Sn0.739Pb0.261 melt;Thermophysics and Aeromechanics;2011-03

2. Liquid metal cooling in thermal management of computer chips;Frontiers of Energy and Power Engineering in China;2007-10

3. A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints;Journal of Electronic Packaging;1998-03-01

4. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints;Thermal Stress and Strain in Microelectronics Packaging;1993

5. Influence of environment on the fatigue of Pb-Sn solder joints;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1991

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