Thermal aging of enameled wire: dielectric markers and structural properties drift correlation
Author:
Affiliation:
1. IRT Antoine de Saint Exupéry, 3 Rue Tarfaya, CS 34436,Toulouse,France,cedex 4
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9863422/9863219/09863573.pdf?arnumber=9863573
Reference8 articles.
1. Dielectric properties and PD resistance of epoxy/fumed and precipitated silica and alumina nanocomposites
2. Degradation of PAI/PEI Enamel under High Temperature (Up to 400°C)
3. IEC 60317-0-1: Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire,0
4. Electric conductivity, aging and chemical degradation of polyesterimide resins used in the impregnation of rotating machines
5. Multi-scale and multi-technical analysis of the thermal degradation of poly(ether imide)
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