1. Institut für Nachrichtentechnik, Technische Universität Braunschweig, Braunschweig, Germany
2. Deutsche Telekom AG, Berlin, Germany
3. CNRS, Institut d'Electronique, Microelectronique et Nanotechnologie, IEMN, Univ. Lille, Lille, France
4. Faculty of Engineering, Chiba Institute of Technology, Narashino-shi, Japan
5. Electrical and Energy System Engineering Division, Faculty of Engineering, Gifu University, Gifu, Japan
6. Fraunhofer IAF, Fraunhofer Institute for Applied Solid State Physics, Freiburg, Germany
7. Institute of Robust Power Semiconductor Systems, University of Stuttgart, Stuttgart, Germany
8. Faculty of Science and Engineering, Waseda University, Shinjuku-ku, Tokyo, Japan
9. HRCP Research and Development Partnership, Tokyo, Japan
10. Siklu Communications Ltd., Petach Tikva, Israel
11. Vivid Components Germany UG, Paderborn, Germany
12. CNRS, Laboratoire de Physique des Lasers, Atomes et Molécules, PhLAM, Univ. Lille, Lille, France