Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range-Reference-Cited by-同舟云学术

Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range

Published:2023-01 Issue:1 Volume:13 Page:34-43
ISSN:2156-342X
Container-title:IEEE Transactions on Terahertz Science and Technology
language:
Short-container-title:IEEE Trans. THz Sci. Technol.

Author:

Rivera-Lavado Alejandro¹^ORCID,Ali Muhsin²^ORCID,Gallego-Cabo Daniel²^ORCID,Garcia-Munoz Luis-Enrique³^ORCID,Lioubtchenko Dmitri V.⁴^ORCID,Carpintero Guillermo²^ORCID

Affiliation:

1. Departamento de Teoría de la Señal y Comunicaciones, Leganés, Universidad Carlos III de Madrid, Leganes, Spain

2. Departamento de Tecnología Electrónica, Leganés, Universidad Carlos III de Madrid, Madrid, Spain

3. Departamento de Teoría de la Señal y Comunicaciones, Leganés, Madrid, Universidad Carlos III de Madrid, Madrid, Spain

4. Department of Micro and Nano Science, KTH Royal Institute of Technology, Stockholm, Sweden

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Radiation

Link

http://xplorestaging.ieee.org/ielx7/5503871/10021284/09915467.pdf?arnumber=9915467

Reference29 articles.

1. Packages for Terahertz Electronics

2. Terahertz Micromachined On-Wafer Probes: Repeatability and Reliability

3. On the Accurate Measurement and Calibration of S-Parameters for Millimeter Wavelengths and Beyond

4. Crosstalk Corrections for Coplanar-Waveguide Scattering-Parameter Calibrations

5. Influence of Microwave Probes on Calibrated On-Wafer Measurements

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