Author:
Weber C.,Moslehi B.,Dutta M.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Wafer defect recognition method based on multi-scale feature fusion;Frontiers in Neuroscience;2023-06-02
2. An Auto-adjusting Weight Model for Imbalanced Wafer Defects Recognition;2022 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD);2022-11-30
3. Selective Absorption of Knowledge : How R&D Project Groups can Harness the Power of Absorptive Capacity;2022 Portland International Conference on Management of Engineering and Technology (PICMET);2022-08
4. Toward a Pragmatic Theory for Managing Nescience;International Journal of Innovation and Technology Management;2018-09-26
5. Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for High-Yield Etching Process;IEEE Transactions on Semiconductor Manufacturing;2014-05