Author:
Butler J.T.,Bright V.M.,Comtois J.H.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit;Sensors;2023-01-09
2. A quality quantitative method of silicon direct bonding based on wavelet image analysis;Journal of Micromechanics and Microengineering;2018-02-19
3. Surface micromachined segmented mirrors for adaptive optics;IEEE Journal of Selected Topics in Quantum Electronics;1999
4. Challenges in the packaging of MEMS;Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)