Highly reliable STT-MRAM adopting advanced MTJs with controlled domain wall pinning
Author:
Affiliation:
1. Semiconductor R&D Center, Samsung Electronics, Co. Ltd,Hwaseong,South Korea
2. Samsung Advanced Institute of Technology, Samsung Electronics Co. Ltd,Suwon,South Korea
3. Foundry Business, Samsung Electronics Co. Ltd,Kiheung,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019352.pdf?arnumber=10019352
Reference8 articles.
1. 28-nm 0.08mm2/Mb Embedded MRAM for Frame Buffer Memory;han;IEDM Tech Dig,2020
2. 22-nm FD-SOI Embedded MRAM Technology for Low-Power Automotive-Grade-l MCU Applications
3. Switching Distributions for Perpendicular Spin-Torque Devices Within the Macrospin Approximation
4. A novel integration of STT-MRAM for on-chip hybrid memory by utilizing non-volatility modulation
5. Energy barriers in magnetic random access memory elements
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1. Scanning Magneto-Optic Kerr Effect Microscope for Inspection of MRAM Manufacturing;IEEE Transactions on Magnetics;2023-11
2. Transitioning eMRAM from Pilot Project to Volume Production;2023 IEEE International Test Conference (ITC);2023-10-07
3. Full reliability characterization of three-terminal SOT-MTJ devices and corresponding arrays;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
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