Author:
Baba S.,Qiang Wu ,Hayashi E.,Watanabe M.,Matsushima H.,Tomita Y.,Takemoto Y.
Cited by
2 articles.
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1. Study of package warp behavior for high-performance flip-chip BGA;Microelectronics Reliability;2003-03
2. Thermally induced deformations in a flip-chip HDI substrate;2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)