Impact of Port Type in S-Parameter Extraction of Package and PCB High-Speed Interconnections-Reference-Cited by-同舟云学术

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Impact of Port Type in S-Parameter Extraction of Package and PCB High-Speed Interconnections

Published:2024-05-12 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)
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Author:

Occhiali Marco¹,Sanna Aurora²,Cucchi Simona²

Affiliation:

1. Ansys Italia,Ansys Customer Excellence, Electronics EMEA SIPI Team,Milano,Italy

2. STMicroelectronics,Back-end Manufacturing and Technology R&D,Agrate Brianza,Italy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10539129/10539187/10539204.pdf?arnumber=10539204

Reference7 articles.

1. Impact of Ports Reference Choice on S-Parameter Modeling of BGA Package Interconnections

2. Introduction to Electromagnetic Compatibility

3. High speed interconnect crosstalk characterization for next generation servers

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