Funder
U.S. Department of Homeland Security, Science and Technology Directorate, Office of University Programs
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Experimental Results;Springer Theses;2022
2. Enabling curved hemispherical arrays with Quilt Packaging interconnect technology;Image Sensing Technologies: Materials, Devices, Systems, and Applications VI;2019-05-13