Analysis and Research on Thermal-Force Coupling Performance of a Vehicle Controller PCB Board-Reference-Cited by-同舟云学术

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Analysis and Research on Thermal-Force Coupling Performance of a Vehicle Controller PCB Board

Published:2020-05 Issue: Volume: Page:
ISSN:
Container-title:2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)
language:
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Author:

Chen Yajuan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9120086/9122070/09122139.pdf?arnumber=9122139

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Layout Optimization of Power Devices on PCB;Lecture Notes in Electrical Engineering;2024

2. Heat transfer enhancement of electronic devices by using flexible printed circuit boards;Journal of Thermal Engineering;2023-11-30

3. Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration;IEEE Transactions on Electromagnetic Compatibility;2023

4. Experimental and numerical study heat transfer performance for printed circuit board;AIP Conference Proceedings;2023

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