Unsupervised Seismic Footprint Removal With Physical Prior Augmented Deep Autoencoder

Author:

Qian Feng1ORCID,Yue Yuehua2,He Yu2ORCID,Yu Hongtao3,Zhou Yingjie4ORCID,Tang Jinliang5,Hu Guangmin2

Affiliation:

1. School of Information and Communication Engineering and the Center for Information Geoscience, University of Electronic Science and Technology of China, Chengdu, China

2. School of Resource and Environment and the Center for Information Geoscience, University of Electronic Science and Technology of China, Chengdu, China

3. Finance-Trading Finance Products Department, Huawei Technologies Company Ltd., Shenzhen, China

4. College of Computer Science, Sichuan University (SCU), Chengdu, China

5. Sinopec Geophysical Research Institute (SGRI), Institute of Seismic Imaging Technology, Nanjing, China

Funder

National Natural Science Foundation of China

Higher Education Discipline Innovation Project

Sichuan Science and Technology Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Earth and Planetary Sciences,Electrical and Electronic Engineering

Reference55 articles.

1. Adapting to noisy 3D data ‐ attenuating the acquisition footprint

2. Acquisition geometry footprints removal;gülünay;Proc 69th Annu Int Meeting SEG Tech Program Expanded Abstr,1999

3. Acquisition footprint suppression via the truncated SVD technique

4. Acquisition footprint suppression via the truncated SVD technique: Case studies from Saudi Arabia

5. Autoencoders, minimum description length and Helmholtz free energy;hinton;Proc Adv Neural Inf Process Syst (NIPS),1993

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