3D measurement of thermal deformations on an ultra-high density circuit moduled with a laser range probe-Reference-Cited by-同舟云学术

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3D measurement of thermal deformations on an ultra-high density circuit moduled with a laser range probe

Published:1992 Issue:4 Volume:15 Page:571-577
ISSN:0148-6411
Container-title:IEEE Transactions on Components, Hybrids, and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Comp., Hybrids, Manufact. Technol.

Author:

Gloeckner P.J.,Kokini K.,Stevenson W.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx1/33/4187/00159887.pdf?arnumber=159887

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative analysis of pulse and active thermography for investigating solder joint geometry prediction;SPIE Proceedings;2011-05-13

2. Intermittent process hybrid measurement system on the machining centre;International Journal of Production Research;2003-12

3. DEVELOP A METHODOLOGY FOR EVALUATING A HYBRID 3D NONCONTACT MEASUREMENT SYSTEM CAPABILITY;Journal of the Chinese Institute of Industrial Engineers;2003-01

4. The measurement and analysis of the three-dimensional form of curved surfaces;International Journal of Machine Tools and Manufacture;1996-05

5. The evaluation of arc erosion on electrical contacts using three-dimensional surface profiles;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A;1996-03

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