Funder
National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
15 articles.
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1. Improved response of TVS and PIN diode combined electromagnetic protection;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20
2. Design and Test of S-Band High Power Limiter;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20
3. Usage of Ansys in Electrostatic Discharge (ESD) Simulations for Automotive Devices;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04
4. Improved SEED Modeling of an ESD Discharge to a USB Cable;IEEE Transactions on Electromagnetic Compatibility;2023-06
5. Study on ESD Protection Circuit by TCAD Simulation and TLP Experiment;Micromachines;2023-03-04