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A Novel Vertical Wire-Bonding Compensation Structure Adaptively Modeled and Optimized With GRNN and GA Methods for System in Package

  • Published:2021-12 Issue:6 Volume:63 Page:2082-2092
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Zhu Hao-RanORCID,Zhao Ya-LiORCID,Lu Jia-GuoORCID

Funder

National Natural Science Foundation of China

Major Project of Science and Technology of Anhui Province

Union foundation Program of Key Lab of Ministry of Education for Research of Design and EMC of High Speed Electronic System

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impedance Compensation for Interconnection Structure with Large Inductance on PCB Using Capacitors;2023 12th International Conference on Power Science and Engineering (ICPSE);2023-09-22

2. Inverse Design of Bonding Wire Array Based on Multifidelity Data-Enabled Neural Networks;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

3. Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems;Micromachines;2023-01-29

4. Three-Dimensional Interconnection With Magnetically Coupled Transition for W-Band Integration Applications;IEEE Transactions on Microwave Theory and Techniques;2023-01

5. Investigation of impedance compensation in radio frequency circuits with bonding wire;International Journal of RF and Microwave Computer-Aided Engineering;2022-03-16
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