Study of Superconducting Equilateral Triangular Patch printed on Anisotropic Dielectric Substrates-Reference-Cited by-同舟云学术

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Study of Superconducting Equilateral Triangular Patch printed on Anisotropic Dielectric Substrates

Published:2022-10-29 Issue: Volume: Page:
ISSN:
Container-title:2022 2nd International Conference on Advanced Electrical Engineering (ICAEE)
language:
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Author:

Agaba Chahinaz¹,Bedra Randa²,Bedra Sami²,Benkouda Sihem³,Fortaki Tarek¹

Affiliation:

1. University Ferhat Abbas Setif 1,Department of Electronic,Setif,Algeria,19000

2. University of Batna 2,L.E.A, Department of Electronics,Batna,Algeria,05000

3. University of Frères Mentouri-Constantine 1,Department of Electronics,Constantine,Algeria,25000

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9961845/9961963/09961965.pdf?arnumber=9961965

Reference24 articles.

1. Efficient full-wave analysis of inverted circular microstrip antenna

2. A simple design of planar microstrip antenna on composite material substrate for Ku/K band satellite applications

3. Characteristics of a high Tc superconducting rectangular microstrip patch on uniaxially anisotropic substrate

4. Efficient CAD Model to Analysis of High Tc Superconducting Circular Microstrip Antenna on Anisotropic Substrates

5. Hankel transform domain analysis of covered circular microstrip patch printed on an anisotropic dielectric layer

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