Thermal Characterization of Planar Integrated Inductors-Reference-Cited by-同舟云学术

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Thermal Characterization of Planar Integrated Inductors

Published:2022-07-11 Issue: Volume: Page:
ISSN:
Container-title:2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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Author:

Bechir Basma M.¹,Pietroy David¹,Boukhari Mahamat I.¹,Blanchet Thomas¹,Chatelon Jean-Pierre¹,Capraro Stephane¹,Rousseau Jean-Jacques¹

Affiliation:

1. Univ Lyon, UJM-Saint-Etienne, CNRS, Lab.H.C UMR 5516,Saint-Etienne,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9911657/9911709/09911750.pdf?arnumber=9911750

Reference10 articles.

1. Thermal investigation of a planar core power transformer

2. Stresses Evolution at High Temperature (200°C) on the Inferface of Thin Films in Magnetic Components;doumit;The European Physical Journal Conferences,2014

3. Electrical-Thermal Co-Simulation for Analysis of High-Power RF/Microwave Components

4. Thermal analysis and modelling of planar magnetic components

5. Electro-thermal simulation study of different core shape planar transformer

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On thermal characterization method of integrated magnetic components;Scientific Reports;2024-02-28

2. Thermal Characterization of Electronic Power Component: a comparison between resistive and fiber Bragg grating sensors;2023-05-04

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