Re-consideration of influence of silicon wafer surface orientation on gate oxide reliability from TDDB statistics point of view
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5482567/5488659/05488812.pdf?arnumber=5488812
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Review of Reliability in Gate-All-Around Nanosheet Devices;Micromachines;2024-02-13
2. Experimental investigations on ferroelectric dielectric breakdown in sub-10 nm Hf0.5Zr0.5O2 film through comprehensive TDDB characterizations;Japanese Journal of Applied Physics;2022-10-01
3. Experimental study of time-dependent dielectric breakdown in tri-gate nanowire transistor;Japanese Journal of Applied Physics;2016-07-11
4. Characteristics of Defect Generation and Breakdown in SiO$_{2}$ for Polycrystalline Silicon Channel Field-Effect Transistor;Japanese Journal of Applied Physics;2012-04-20
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