Numerical Investigation on Thermal Stability of Conduction-Cooled Bi-2223/Ag Coil Under AC Ripple Current for Space Applications
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Published:2014-06
Issue:3
Volume:24
Page:1-5
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ISSN:1051-8223
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Container-title:IEEE Transactions on Applied Superconductivity
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language:
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Short-container-title:IEEE Trans. Appl. Supercond.
Author:
Nagasaki Yoh,Nakamura Taketsune,Funaki Ikkoh,Ashida Yasumasa,Yamakawa Hiroshi
Funder
engineering committee of the Institute of Space and Astronautical Science of the Japan Aerospace Exploration Agency
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials