Effect of Cu Addition Into $\hbox{TiGa}_{3}$ Compound on Superconducting Properties and Microstructure of $ \hbox{V}_{3}\hbox{Ga}$ Multifilamentary Wires Synthesized Through High Ga Content Diffusion Process
-
Published:2013-06
Issue:3
Volume:23
Page:7101204-7101204
-
ISSN:1051-8223
-
Container-title:IEEE Transactions on Applied Superconductivity
-
language:
-
Short-container-title:IEEE Trans. Appl. Supercond.
Author:
Hishinuma Y.,Kikuchi A.,Iijima Y.,Murakami S.,Kawabata T.,Matsuda K.,Taniguchi H.,Takeuchi T.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials