Investigation of Dynamic Behaviors of Low-Level Dissipation at ${\rm YBa}_{2}{\rm Cu}_{3}{\rm O}_{7}$ Grain Boundaries Using Low-Temperature Near-Field Scanning Microwave Microscopy
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Published:2011-06
Issue:3
Volume:21
Page:3238-3242
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ISSN:1051-8223
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Container-title:IEEE Transactions on Applied Superconductivity
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language:
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Short-container-title:IEEE Trans. Appl. Supercond.
Author:
Lu Rongtao,Christianson Caleb,Dizon Jonathan,Wu Judy,Haugan Timothy,Barnes Paul,Baca F. Javier
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials