Author:
Changsoo Jang ,Geun Sik Ahn ,Yung Joon Kim ,Dong Ok Kwak ,Seong Woon Booh ,Jae Ok Kim
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
3 articles.
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1. Design of highly uniform spool and bar horns for ultrasonic bonding;IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control;2011-10
2. Finite Element Modal Analysis of the Quick Positioning System of Wire Bonders;Applied Mechanics and Materials;2010-10
3. Vibration characteristics of the capillary in ultrasonic wire bonders;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2007-08-01