Flip Chip Assembly of Thinned Silicon Die on Flex Substrates-Reference-Cited by-同舟云学术

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Flip Chip Assembly of Thinned Silicon Die on Flex Substrates

Published:2008-01 Issue:1 Volume:31 Page:1-8
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Banda Charles,Johnson R. Wayne,Zhang Tan,Hou Zhenwei,Charles Harry K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4427303/04427304.pdf?arnumber=4427304

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Direct Write 3D-Printed Interconnects for Heterogenous Integration of Ultra Thin Chips;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10

3. A review of laser ablation and dicing of Si wafers;Precision Engineering;2022-01

4. Electrochemical miniaturized devices;Micro- and Nanotechnology Enabled Applications for Portable Miniaturized Analytical Systems;2022

5. Bonding Methods for Chip Integration with Parylene Devices;Journal of Micromechanics and Microengineering;2021-02-02

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