Surface Resistivity Characterization of New Printed Circuit Board Materials for Use in Spacecraft Electronics-Reference-Cited by-同舟云学术

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Surface Resistivity Characterization of New Printed Circuit Board Materials for Use in Spacecraft Electronics

Published:2007-04 Issue:2 Volume:30 Page:115-122
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Bulletti Andrea,Capineri Lorenzo,Materassi Maurizio,Dunn Barrie D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4265760/04265761.pdf?arnumber=4265761

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Spectral characterization of spacecraft materials used in hypervelocity impact testing;Algorithms, Technologies, and Applications for Multispectral and Hyperspectral Imaging XXVII;2021-04-12

4. Application of non-woven aramid-polyimide composite materials for high reliability printed circuit boards for use in spacecraft electronics;Materials Today: Proceedings;2021

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