Thermal modelling, characterization and optimization of 2.5D heterogeneous integrated platform for RF front end
Author:
Affiliation:
1. Institute of Microelectronics, A*STAR,System in Package,Singapore,Singapore,138634
Funder
National Research Foundation, Singapore (NRF)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013225.pdf?arnumber=10013225
Reference11 articles.
1. Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
2. Process Development and Characterization for Integrating Microchannel into TSV Interposer
3. Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
4. Electro-thermal-mechanical modeling of wire bonding failures in IGBT
5. Techniques to reduce thermal resistance in flip‐chip GaN‐based VCSELs
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