Improving Wirebonding Failure Classification Across Bond Recipe via Machine Learning-Reference-Cited by-同舟云学术

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Improving Wirebonding Failure Classification Across Bond Recipe via Machine Learning

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Hew Bork Hang¹,Lim Kar Wai¹,Sun Yiping¹,Wang Yi Bin¹,Song James Keng Yew¹

Affiliation:

1. ASMPT,Singapore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013249.pdf?arnumber=10013249

Reference8 articles.

1. Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire

2. A survey of transfer learning

3. Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods

4. Recent Advances of Large-Scale Linear Classification

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deep Learning-Based Classification Approach for Wire Bonding Defects Inspection;2023 IEEE 8th International Conference On Software Engineering and Computer Systems (ICSECS);2023-08-25

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